Advanced IC Substrates Market Fuelled by Expanding Electronics Manufacturing and Technological Advancements

Market Data Library - MDL
Market Data Library – MDL

With a projected value of $16,953.8 million by 2031 and a CAGR of 7.1% from 2021 to 2031, the global market for advanced IC substrates is anticipated to experience spectacular growth. The rapid proliferation and improved functionality of consumer electronics products like smart devices and smart wearables, as well as the accelerating deployment of cutting-edge technologies like 5G and IoT connected devices, are some of the major market-driving factors responsible for this exponential growth.

As manufacturers increasingly realise the need for high-performance substrates to fulfil the expanding demands of the electronics industry, the market for advanced IC substrates is seeing a significant uptick. The performance, dependability, and efficiency of integrated circuits (ICs) used in a variety of electronic products, including as smartphones, tablets, wearable technology, and automotive electronics, are significantly improved by these substrates. The need for sophisticated IC substrates is anticipated to grow steadily during the coming ten years as a result of the rising global market for electronic devices, which will encourage innovation and push the limits of technical development.

The global advanced IC substrates market is expected to grow and revolutionise the electronics manufacturing industry in the next years, according to Market Data Library, a top provider of market research reports. Our thorough analysis provides in-depth insights into market trends, development drivers, challenges, and opportunities. As a result, industry stakeholders can make wise decisions and seize the lucrative chances in this market that is quickly expanding.

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Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.1% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.

Highlighted with 82 tables and 82 figures, this 165-page report “Global Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:

  • Market Structure
  • Growth Drivers
  • Restraints and Challenges
  • Emerging Product Trends & Market Opportunities
  • Porter’s Fiver Forces

The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region.

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Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

  • FC BGA
  • FC CSP
  • Other Packaging Types

Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

  • Rigid Integrated Circuit Substrate
  • Flex Integrated Circuit Substrate
  • Ceramic Integrated Circuit Substrate

By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

  • Subtraction Process (SP)
  • Addition Process (AP)
  • Modified Semi-additive Process (MSAP)

By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

  • Wire Bonding
  • FC Bonding
  • Tape Automated Bonding (TAB)

By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

  • Mobile and Consumer Electronics
  • Automotive and Transportation
  • IT and Telecom
  • Other Applications

Geographically, the following regions together with the listed national/local markets are fully investigated:

  • North America (U.S., Canada, and Mexico)
  • Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
  • APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
  • South America (Brazil, Chile, Argentina, Rest of South America)
  • MEA (UAE,Saudi Arabia, South Africa and Rest of MEA)

For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included.

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The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.

Selected Key Players:

ASE Group

AT&S Austria Technologie & Systemtechnik AG

Fujitsu Ltd.

IBIDEN Co., Ltd.

Kinsus Interconnect Technology Corp.

Korea Circuit Co., Ltd.

KYOCERA Corporation

LG Innotek Co., Ltd.

Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)

Shenzhen Fastprint Circuit Tech

Shinko Electric Industries Co., Ltd.

Siliconware Precision Industries Co., Ltd.

STATS ChipPAC Pte. Ltd.

TTM Technologies Inc.

Unimicron Corporation

Zhen Ding Technology Holding Ltd.

Zhuhai ACCESS Semiconductor

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